Invention Grant
- Patent Title: Moisture activated latent curing adhesive or sealant
- Patent Title (中): 水分活化的潜在固化胶或密封剂
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Application No.: US12570350Application Date: 2009-09-30
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Publication No.: US08119831B2Publication Date: 2012-02-21
- Inventor: Chetan Anirudh Khatri
- Applicant: Chetan Anirudh Khatri
- Applicant Address: US NJ Somerville
- Assignee: Ethicon, Inc.
- Current Assignee: Ethicon, Inc.
- Current Assignee Address: US NJ Somerville
- Agent David R. Crichton
- Main IPC: C07C69/34
- IPC: C07C69/34 ; C07C69/52 ; C07C263/00 ; C07C265/00
Abstract:
The invention relates to a novel poly(ethylene oxide)imine; a novel amine reactive moiety; a novel moisture activated latent curing adhesive or sealant mixture comprising (1) a ketimine or aldimine, and (2) an amine reactive moiety; and a novel moisture activated latent curing adhesive or sealant comprising the reaction product of (1) and (2).
Public/Granted literature
- US20100087672A1 MOISTURE ACTIVATED LATENT CURING ADHESIVE OR SEALANT Public/Granted day:2010-04-08
Information query
