Invention Grant
- Patent Title: Cable management patch panel system with vertical ducting
- Patent Title (中): 带垂直管道的电缆管理接线板系统
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Application No.: US12243200Application Date: 2008-10-01
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Publication No.: US08119915B2Publication Date: 2012-02-21
- Inventor: William D. Regester , Frank Chin-Hwan Kim , Ross Goldman
- Applicant: William D. Regester , Frank Chin-Hwan Kim , Ross Goldman
- Applicant Address: US NY Melville
- Assignee: Leviton Manufacturing Co., Inc.
- Current Assignee: Leviton Manufacturing Co., Inc.
- Current Assignee Address: US NY Melville
- Agency: Davis Wright Tremaine LLP
- Agent George C. Rondeau, Jr.; Heather M. Colburn
- Main IPC: H02G3/00
- IPC: H02G3/00
Abstract:
A cable management patch panel system having one or more vertical ducting enclosures and typically located in an equipment rack. The vertical ducting enclosure is integral with the patch panel system and allows for vertical routing of cables connected to the patch panel system. The cables are vertically routed by the ducting enclosure to other patch panels or equipment located along with the patch panel system in a commonly shared equipment rack or located beyond the equipment rack.
Public/Granted literature
- US20090090534A1 CABLE MANAGEMENT PATCH PANEL SYSTEM WITH VERTICAL DUCTING Public/Granted day:2009-04-09
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