Invention Grant
US08119919B2 Printed wiring board, method for manufacturing printed wiring board, and electric device 有权
印刷电路板,印刷电路板的制造方法以及电气装置

Printed wiring board, method for manufacturing printed wiring board, and electric device
Abstract:
Provided are a printed wiring board and a flexible printed wiring board which hardly generate radiation electromagnetic noises and are not easily affected by external noises. First and second wave-shape wirings are provided between at least two insulation substrates stacked on each other. The first and the second wave-shape wirings three-dimensionally intersect with each other in a plane direction and a thickness direction of the insulating substrates. The first and second wave-shape wirings are electrically separated from each other by a resist layer provided between the insulating substrates.
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