Invention Grant
US08119919B2 Printed wiring board, method for manufacturing printed wiring board, and electric device
有权
印刷电路板,印刷电路板的制造方法以及电气装置
- Patent Title: Printed wiring board, method for manufacturing printed wiring board, and electric device
- Patent Title (中): 印刷电路板,印刷电路板的制造方法以及电气装置
-
Application No.: US12376862Application Date: 2007-10-22
-
Publication No.: US08119919B2Publication Date: 2012-02-21
- Inventor: Hiroyoshi Tagi , Eiji Takahashi , Yoshiyuki Saito
- Applicant: Hiroyoshi Tagi , Eiji Takahashi , Yoshiyuki Saito
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- International Application: PCT/JP2007/070524 WO 20071022
- International Announcement: WO2008/050706 WO 20080502
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
Provided are a printed wiring board and a flexible printed wiring board which hardly generate radiation electromagnetic noises and are not easily affected by external noises. First and second wave-shape wirings are provided between at least two insulation substrates stacked on each other. The first and the second wave-shape wirings three-dimensionally intersect with each other in a plane direction and a thickness direction of the insulating substrates. The first and second wave-shape wirings are electrically separated from each other by a resist layer provided between the insulating substrates.
Public/Granted literature
- US20100163282A1 PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND ELECTRIC DEVICE Public/Granted day:2010-07-01
Information query