Invention Grant
- Patent Title: Touch keypad assembly
- Patent Title (中): 触摸键盘组件
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Application No.: US12384227Application Date: 2009-04-02
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Publication No.: US08119938B2Publication Date: 2012-02-21
- Inventor: Hsin-Hsien Yu , Yao-Pang Lu , Chao-Chang Li
- Applicant: Hsin-Hsien Yu , Yao-Pang Lu , Chao-Chang Li
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Inc. Co., Ltd.
- Current Assignee: Hon Hai Precision Inc. Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
- Priority: CN200820034911U 20080402
- Main IPC: H01H13/83
- IPC: H01H13/83
Abstract:
A touch keypad assembly (100) includes a main board (10), a metal dome (40) disposed on a predetermined position of the main board, a touchpad layer (30) disposed on the metal dome, a keypad cover (20) disposed over the touchpad layer, and a light guide film (60) disposed between the metal dome and the keypad cover. The touchpad layer is a flexible printed circuit board.
Public/Granted literature
- US20090250329A1 Touch keypad assembly Public/Granted day:2009-10-08
Information query
