Invention Grant
- Patent Title: Laser cutting shaped holes by trepanning on the fly
- Patent Title (中): 激光切割形状的孔,通过在飞行中掠过
-
Application No.: US12323726Application Date: 2008-11-26
-
Publication No.: US08119949B2Publication Date: 2012-02-21
- Inventor: Lowell Frye
- Applicant: Lowell Frye
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: B23K26/38
- IPC: B23K26/38

Abstract:
A method of forming a plurality of shaped holes on a workpiece. The method may include rotating the workpiece about multiple axes relative to a laser beam, and positioning the laser at a first predetermined angle relative to the workpiece. The laser beam is pulsed to form a first plurality of trepan cuts defining a row of metering holes. The laser beam, after adjusting to a next predetermined angle and adjacent a previous row of trepan cuts, is pulsed to create a plurality of rows of trepan cuts wherein each cut in the previous row of trepan cuts is connected to a cut in said subsequent row of trepan cuts. The plurality of rows of trepan cuts are formed in a side-to-side sweeping formation and define a portion of each of the shaped holes. Next, the laser is pulsed in alignment with the metering hole to remove debris from therein.
Public/Granted literature
- US20100126973A1 LASER CUTTING SHAPED HOLES BY TREPANNING ON THE FLY Public/Granted day:2010-05-27
Information query
IPC分类: