Invention Grant
- Patent Title: Light emitting diode assembly
- Patent Title (中): 发光二极管组件
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Application No.: US12581811Application Date: 2009-10-19
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Publication No.: US08120056B2Publication Date: 2012-02-21
- Inventor: Lig Yi Yong , Kean Loo Keh , Keat Chuan Ng
- Applicant: Lig Yi Yong , Kean Loo Keh , Keat Chuan Ng
- Applicant Address: SG Singapore
- Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
An electronic assembly includes a Light Emitting Diode (LED) mounted on a top surface of a heat spreader, at least two electrical contacts co-planar with the heat spreader, and at least one heat slug mounted on the top surface of the heat spreader, where the heat slug is made of high thermal conductive plastic.
Public/Granted literature
- US20110089460A1 LIGHT EMITTING DIODE ASSEMBLY Public/Granted day:2011-04-21
Information query
IPC分类: