A semiconductor device includes: a channel region extending substantially perpendicular to a main surface of a semiconductor substrate; a first diffusion layer provided on a bottom of the channel region; a second diffusion layer provided on a top of the channel region; a first gate electrode that extends substantially perpendicular to the main surface of the semiconductor substrate and that is provided on a side of the channel region through a gate insulation film; and a second gate electrode that extends substantially parallel to the main surface of the semiconductor substrate and that is connected to the top of the first gate electrode, wherein a planar position of the second gate electrode is offset relative to a planar position of the first gate electrode.