Invention Grant
- Patent Title: Power semiconductor device and method of manufacturing the same
- Patent Title (中): 功率半导体器件及其制造方法
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Application No.: US12396601Application Date: 2009-03-03
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Publication No.: US08120096B2Publication Date: 2012-02-21
- Inventor: Hong Pyo Heo , Keum Hwang
- Applicant: Hong Pyo Heo , Keum Hwang
- Applicant Address: KR Seoul
- Assignee: KEC Corporation
- Current Assignee: KEC Corporation
- Current Assignee Address: KR Seoul
- Agency: Workman Nydegger
- Priority: KR10-2008-0021020 20080306
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/336

Abstract:
A power semiconductor device capable of transmitting gate signals in all directions (e.g., up-/down-ward/right-/left-ward) on a plane and a method of manufacturing the same. The power semiconductor device includes first conductive regions, formed to a predetermined depth in a surface of a conductive low concentration epitaxial layer. The first conductive regions include linear first conductive layers spaced from each other and linear second conductive layers spaced from each other. Second conductive regions are formed to a smaller width and depth than the first and second conductive layers to form channels in the first and second conductive layers. A gate oxide layer formed on a surface of the epitaxial layer defines first windows having a smaller width than the first conductive layers and second windows having a smaller width than the second conductive layers. A gate polysilicon layer is formed on the gate oxide layer.
Public/Granted literature
- US20090224310A1 POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-09-10
Information query
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