Invention Grant
- Patent Title: Integrated circuit comb capacitor
- Patent Title (中): 集成电路梳状电容
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Application No.: US12034728Application Date: 2008-02-21
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Publication No.: US08120143B2Publication Date: 2012-02-21
- Inventor: Daniel C. Edelstein , Anil K. Chinthakindi , Timothy J. Dalton , Ebenezer E. Eshun , Jeffrey P. Gambino , Sarah L. Lane , Anthony K. Stamper
- Applicant: Daniel C. Edelstein , Anil K. Chinthakindi , Timothy J. Dalton , Ebenezer E. Eshun , Jeffrey P. Gambino , Sarah L. Lane , Anthony K. Stamper
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Katherine S. Brown
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
The invention is directed to an integrated circuit comb capacitor with capacitor electrodes that have an increased capacitance between neighboring capacitor electrodes as compared with other interconnects and via contacts formed in the same metal wiring level and at the same pitches. The invention achieves a capacitor that minimizes capacitance tolerance and preserves symmetry in parasitic electrode-substrate capacitive coupling, without adversely affecting other interconnects and via contacts formed in the same wiring level, through the use of, at most, one additional noncritical, photomask.
Public/Granted literature
- US20080130200A1 Integrated Circuit Comb Capacitor Public/Granted day:2008-06-05
Information query
IPC分类: