Invention Grant
- Patent Title: Integrated circuit package system with die on base package
- Patent Title (中): 集成电路封装系统，带基片封装
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Application No.: US11307723Application Date: 2006-02-17
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Publication No.: US08120156B2Publication Date: 2012-02-21
- Inventor: Zigmund Ramirez Camacho , Henry D. Bathan , Arnel Trasporto , Jeffrey D. Punzalan
- Applicant: Zigmund Ramirez Camacho , Henry D. Bathan , Arnel Trasporto , Jeffrey D. Punzalan
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Mikio Ishimaru
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
The present invention provides an integrated circuit package system with die on base package comprising forming a base package comprising, forming a substrate, mounting a first integrated circuit on the substrate, encapsulating the integrated circuit and the substrate with a molding compound, and testing the base package, attaching a bare die to the base package, connecting electrically the bare die to the substrate and encapsulating the bare die and the base package.
Public/Granted literature
- US20070194424A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIE ON BASE PACKAGE Public/Granted day:2007-08-23
Information query
IPC分类:
