Invention Grant
- Patent Title: Integrated circuit comprising conductive lines and contact structures and method of manufacturing an integrated circuit
- Patent Title (中): 包括导线和接触结构的集成电路以及制造集成电路的方法
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Application No.: US12354140Application Date: 2009-01-15
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Publication No.: US08120182B2Publication Date: 2012-02-21
- Inventor: Andreas Thies , Sirko Kramp , Helmut Schneider , Rainer Florian Schnabel
- Applicant: Andreas Thies , Sirko Kramp , Helmut Schneider , Rainer Florian Schnabel
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agent John S. Economou
- Priority: DE102008004927 20080118
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
An integrated circuit comprises a first conductive lines and second lines as well as contact structures being in contact with the first and second conductive lines. The first conductive lines are arranged in a first metallization level, and second conductive lines are arranged in a second metallization level arranged above the first metallization level. The second conductive lines are arranged above the contact structures, and a pitch of neighboring contact structures is equal to a pitch of neighboring second conductive lines. The distance between neighboring contact structures is smaller than 100 nm.
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