Invention Grant
- Patent Title: Wiring terminal-connecting adhesive
- Patent Title (中): 接线端子连接胶
-
Application No.: US12139306Application Date: 2008-06-13
-
Publication No.: US08120189B2Publication Date: 2012-02-21
- Inventor: Motohiro Arifuku , Itsuo Watanabe , Kouji Motomura , Kouji Kobayashi , Yasushi Gotoh , Tohru Fujinawa
- Applicant: Motohiro Arifuku , Itsuo Watanabe , Kouji Motomura , Kouji Kobayashi , Yasushi Gotoh , Tohru Fujinawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP11-238408 19990825
- Main IPC: C09J7/02
- IPC: C09J7/02 ; B29C65/48 ; B29C65/02 ; H01B1/06 ; B32B7/12
Abstract:
A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles.
Public/Granted literature
- US20090101279A1 ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE Public/Granted day:2009-04-23
Information query
