Invention Grant
- Patent Title: Slip ring assembly
- Patent Title (中): 滑环组件
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Application No.: US12386204Application Date: 2009-04-15
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Publication No.: US08120228B2Publication Date: 2012-02-21
- Inventor: Paul A. Carvalho
- Applicant: Paul A. Carvalho
- Applicant Address: US IL Rockford
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US IL Rockford
- Agency: Kinney & Lange, P.A.
- Main IPC: H01R39/08
- IPC: H01R39/08

Abstract:
A split slip ring assembly formed from first and second halves of a slip ring having a contact surface for rotational engagement with a stationary brush element for transferring electrical signals there between. The contact surface has a smooth surface at the junction of the first and second halves. A fastener locates the first and second halves to form a ring shape. An electrical contact on the ring carries electrical signals between the slip ring and the brush element. An alignment element aligns the first and second halves to form the smooth surface at their junction.
Public/Granted literature
- US20100013348A1 Slip ring assembly Public/Granted day:2010-01-21
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