Invention Grant
- Patent Title: Solid-state image pickup device and method of manufacturing same
- Patent Title (中): 固态摄像装置及其制造方法
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Application No.: US12372857Application Date: 2009-02-18
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Publication No.: US08120684B2Publication Date: 2012-02-21
- Inventor: Shinichi Arakawa
- Applicant: Shinichi Arakawa
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2008-054560 20080305
- Main IPC: H04N3/14
- IPC: H04N3/14

Abstract:
Disclosed herein is a solid-state image pickup device including: a photoelectric conversion section configured to convert incident light into a signal charge; a transfer transistor configured to read the signal charge from the photoelectric conversion section and transfer the signal charge; and an amplifying transistor configured to amplify the signal charge read by the transfer transistor, wherein a compressive stress film having a compressive stress is formed on the amplifying transistor.
Public/Granted literature
- US20090225209A1 SOLID-STATE IMAGE PICKUP DEVICE AND METHOD OF MANUFACTURING SAME Public/Granted day:2009-09-10
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