Invention Grant
US08120684B2 Solid-state image pickup device and method of manufacturing same 有权
固态摄像装置及其制造方法

  • Patent Title: Solid-state image pickup device and method of manufacturing same
  • Patent Title (中): 固态摄像装置及其制造方法
  • Application No.: US12372857
    Application Date: 2009-02-18
  • Publication No.: US08120684B2
    Publication Date: 2012-02-21
  • Inventor: Shinichi Arakawa
  • Applicant: Shinichi Arakawa
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: SNR Denton US LLP
  • Priority: JP2008-054560 20080305
  • Main IPC: H04N3/14
  • IPC: H04N3/14
Solid-state image pickup device and method of manufacturing same
Abstract:
Disclosed herein is a solid-state image pickup device including: a photoelectric conversion section configured to convert incident light into a signal charge; a transfer transistor configured to read the signal charge from the photoelectric conversion section and transfer the signal charge; and an amplifying transistor configured to amplify the signal charge read by the transfer transistor, wherein a compressive stress film having a compressive stress is formed on the amplifying transistor.
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