Invention Grant
- Patent Title: Heat dissipation device
- Patent Title (中): 散热装置
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Application No.: US12824511Application Date: 2010-06-28
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Publication No.: US08120917B2Publication Date: 2012-02-21
- Inventor: Zeu-Chia Tan
- Applicant: Zeu-Chia Tan
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99117369A 20100531
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/00
Abstract:
An exemplary heat dissipation device includes first and second heat sinks adapted for being thermally attached to first and second electronic components, respectively; and a heat pipe thermally interconnecting the first heat sink with the second heat sink.
Public/Granted literature
- US20110292608A1 HEAT DISSIPATION DEVICE Public/Granted day:2011-12-01
Information query
