Invention Grant
- Patent Title: Heat dissipation device
- Patent Title (中): 散热装置
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Application No.: US12873209Application Date: 2010-08-31
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Publication No.: US08120918B2Publication Date: 2012-02-21
- Inventor: Jian Liu
- Applicant: Jian Liu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910309642 20091112
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/00 ; F28F7/00 ; H01L23/34

Abstract:
An exemplary heat dissipation device includes a fan having a plurality of first fixing cylinders, a heat sink having a plurality of second fixing cylinders, and a plurality of fasteners fixing the fan to the heat sink. Each of the fasteners includes a screwing post, an elastic member encircling the screwing post, and an annular fastening collar engaging with the screwing post. Each of the fasteners extends through a corresponding first fixing cylinder of the fan and a corresponding second fixing cylinder of the heat sink. The elastic member of each fastener is compressed between the corresponding first fixing cylinder and the corresponding second fixing cylinder.
Public/Granted literature
- US20110110040A1 HEAT DISSIPATION DEVICE Public/Granted day:2011-05-12
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