Invention Grant
- Patent Title: Computer system with heat sink
- Patent Title (中): 带散热器的电脑系统
-
Application No.: US12712300Application Date: 2010-02-25
-
Publication No.: US08120920B2Publication Date: 2012-02-21
- Inventor: Chen-Lu Fan , Li-Ping Chen , Yi-Lung Chou
- Applicant: Chen-Lu Fan , Li-Ping Chen , Yi-Lung Chou
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200920314398 20091109
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34

Abstract:
A computer system includes a chassis, a motherboard secured to the chassis, and a heat sink. A chip is mounted on the motherboard. A securing component secured to the motherboard adjacent the chip. The securing component defines an opening. Two positioning posts are located on the motherboard and adjoin two opposite edges of the opening. Each positioning post defines a fastener hole. A heat sink includes a main body and a fin portion located on the fin portion. The main body defines two through holes. The main body defines two recesses to expose the through holes. The heat sink is secured to the securing component, by two fasteners engaged in the through holes and the fastener holes.
Public/Granted literature
- US20110110030A1 COMPUTER SYSTEM WITH HEAT SINK Public/Granted day:2011-05-12
Information query