Invention Grant
- Patent Title: Tapered capacitive sensing structure
- Patent Title (中): 锥形电容式感应结构
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Application No.: US11437507Application Date: 2006-05-18
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Publication No.: US08121283B2Publication Date: 2012-02-21
- Inventor: Tao Peng , Zheng Qin
- Applicant: Tao Peng , Zheng Qin
- Applicant Address: US CA San Jose
- Assignee: Cypress Semiconductor Corporation
- Current Assignee: Cypress Semiconductor Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H04M9/00
Abstract:
A touchpad has interleaved conductive traces across a touchpad surface. Each conductive trace has a first end and a second end. The width of the first end is larger than the width of the second end. The interleaved conductive traces have a first group of conductive traces alternated with a second group of conductive traces.
Public/Granted literature
- US20070271399A1 Tapered capsense structure Public/Granted day:2007-11-22
Information query
