A hermetically packaged, MEMS array-based ROADM module is disclosed. The enclosure sidewalls and a top lid are made of Kovar, and the base is made of alumina ceramic AuSn-soldered to the enclosure sidewalls. The MEMS array is attached to the ceramic base. The optics are passively pre-aligned using a removable template and epoxied to an optical bench. The optical bench is actively aligned as a whole and attached to the ceramic base. A plurality of electrical feedthrough contact pins extend from the bottom of the ceramic base for connecting the MEMS to a connector on a printed circuit board. In one embodiment of the invention, the ceramic base extends beyond the footprint of the sidewalls of the enclosure of the module, for mounting additional electronic components, for example MEMS driver circuitry chips, directly to the ceramic base of the enclosure.