Invention Grant
- Patent Title: Temperature measurement in a substrate processing apparatus
- Patent Title (中): 基板处理装置中的温度测量
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Application No.: US12267267Application Date: 2008-11-07
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Publication No.: US08122851B2Publication Date: 2012-02-28
- Inventor: Tetsuya Hamada
- Applicant: Tetsuya Hamada
- Applicant Address: JP Kyoto
- Assignee: Sokudo Co., Ltd.
- Current Assignee: Sokudo Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2007-294343 20071113
- Main IPC: B05C5/02
- IPC: B05C5/02

Abstract:
A substrate processing apparatus is configured to provide in series a plurality of processing blocks, each block including a processing unit and a transport robot transporting a substrate. A substrate rest is provided in a connecting portion of adjacent processing blocks. A sensor plate with sensor coils is provided spanning over support pins of the substrate rest. Once a temperature-measurement substrate with temperature-measuring elements, each element formed by connecting a coil to a quartz resonator, is placed on the support pins, a transmitter-receiver transmits transmission waves corresponding to the characteristic frequencies of the quartz resonators to the temperature-measuring elements through the sensor coils. After the stop of the transmission, the transmitter-receiver receives electromagnetic waves from the temperature-measuring elements through the sensor coils, and the temperature computer computes the substrate temperature based on the frequencies of the electromagnetic waves.
Public/Granted literature
- US20090120362A1 TEMPERATURE MEASUREMENT IN A SUBSTRATE PROCESSING APPARATUS Public/Granted day:2009-05-14
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