Invention Grant
US08124879B2 Printed board 有权
印刷板

  • Patent Title: Printed board
  • Patent Title (中): 印刷板
  • Application No.: US12301409
    Application Date: 2007-05-18
  • Publication No.: US08124879B2
    Publication Date: 2012-02-28
  • Inventor: Motonari Ogura
  • Applicant: Motonari Ogura
  • Applicant Address: JP Osaka
  • Assignee: Panasonic Corporation
  • Current Assignee: Panasonic Corporation
  • Current Assignee Address: JP Osaka
  • Agency: Pearne & Gordon LLP
  • Priority: JP2006-141145 20060522
  • International Application: PCT/JP2007/060241 WO 20070518
  • International Announcement: WO2007/135997 WO 20071129
  • Main IPC: H05K1/00
  • IPC: H05K1/00
Printed board
Abstract:
A printed wiring board includes a substrate member, terminals and wiring pattern. The terminals are formed in a specific shape on the substrate member and arranged to be aligned in a specific arrangement direction on the substrate member. The wiring pattern is formed on the opposite side across the substrate member from a terminal portion where the terminals are formed, and a plurality of slits are formed extending in a direction perpendicular to the specific arrangement direction.
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