Invention Grant
- Patent Title: Printed board
- Patent Title (中): 印刷板
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Application No.: US12301409Application Date: 2007-05-18
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Publication No.: US08124879B2Publication Date: 2012-02-28
- Inventor: Motonari Ogura
- Applicant: Motonari Ogura
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2006-141145 20060522
- International Application: PCT/JP2007/060241 WO 20070518
- International Announcement: WO2007/135997 WO 20071129
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A printed wiring board includes a substrate member, terminals and wiring pattern. The terminals are formed in a specific shape on the substrate member and arranged to be aligned in a specific arrangement direction on the substrate member. The wiring pattern is formed on the opposite side across the substrate member from a terminal portion where the terminals are formed, and a plurality of slits are formed extending in a direction perpendicular to the specific arrangement direction.
Public/Granted literature
- US20090107700A1 PRINTED BOARD Public/Granted day:2009-04-30
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