Invention Grant
- Patent Title: Ceramic multilayer substrate and method for manufacturing the same
- Patent Title (中): 陶瓷多层基板及其制造方法
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Application No.: US12635782Application Date: 2009-12-11
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Publication No.: US08124883B2Publication Date: 2012-02-28
- Inventor: Osamu Chikagawa
- Applicant: Osamu Chikagawa
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2004-317312 20041029
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
In a method for manufacturing a ceramic multilayer substrate, when a green ceramic stack prepared by stacking a plurality of ceramic green sheets is fired simultaneously with a ceramic chip electronic component disposed inside the green ceramic stack and including an external terminal electrode to produce a ceramic multilayer substrate having the ceramic chip electronic component inside, a paste layer is disposed in advance between the ceramic chip electronic component and the green ceramic stack, and these three are fired.
Public/Granted literature
- US20100092742A1 CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-04-15
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