Invention Grant
- Patent Title: Light emitting device package
- Patent Title (中): 发光装置封装
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Application No.: US11225090Application Date: 2005-09-14
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Publication No.: US08124998B2Publication Date: 2012-02-28
- Inventor: Hyung-kun Kim
- Applicant: Hyung-kun Kim
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: KR10-2004-0101653 20041206
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A light emitting device package is provided. The light emitting device package includes: a light emitting device; and first and second electrodes disposed a predetermined distance from each other and respectively adhered to the light emitting device so as to be electrically connected to the light emitting device, the first and second electrodes applying a current or voltage to the light emitting device and emitting heat generated by the light emitting device.
Public/Granted literature
- US20060118800A1 Light emitting device package Public/Granted day:2006-06-08
Information query
IPC分类:
