Invention Grant
- Patent Title: Semiconductor element and method for manufacturing same
- Patent Title (中): 半导体元件及其制造方法
-
Application No.: US12300352Application Date: 2007-05-17
-
Publication No.: US08125005B2Publication Date: 2012-02-28
- Inventor: Masao Uchida , Koichi Hashimoto , Masashi Hayashi
- Applicant: Masao Uchida , Koichi Hashimoto , Masashi Hayashi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JP2006-139128 20060518
- International Application: PCT/JP2007/060108 WO 20070517
- International Announcement: WO2007/135940 WO 20071129
- Main IPC: H01L27/148
- IPC: H01L27/148

Abstract:
A semiconductor device includes: a semiconductor layer 10; a semiconductor region 15s of a first conductivity type defined on the surface 10s of the semiconductor layer; a semiconductor region 14s of a second conductivity type defined on the surface 10s of the semiconductor layer to surround the semiconductor region 15s; and a conductor 19 with a conductive surface 19s to contact with the semiconductor regions 15s and 14s. The semiconductor layer 10 includes silicon carbide. At least one of the semiconductor region 15s and the conductive surface 19s is not circular. The semiconductor region 15s and the conductive surface 19s are shaped such that as the degree of misalignment between the conductive surface 19s and the semiconductor region 15s increases from zero through one-third of the width of the conductive surface 19s, a portion of the profile of the conductive surface 19s that crosses the semiconductor region 15s has smoothly changing lengths.
Public/Granted literature
- US20090101918A1 SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING SAME Public/Granted day:2009-04-23
Information query
IPC分类: