Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12585040Application Date: 2009-09-01
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Publication No.: US08125010B2Publication Date: 2012-02-28
- Inventor: Hiroaki Mizushima
- Applicant: Hiroaki Mizushima
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2008-230572 20080909
- Main IPC: H01L31/062
- IPC: H01L31/062

Abstract:
A semiconductor device is proposed in which signal delay due to compensation capacitance elements in peripheral circuit element regions is eliminated. The semiconductor device includes: a first region including memory cells; a second region 10 including a functional circuit; cell capacitors formed in the first region; and compensation capacitance elements 36 to 38 formed in the second region 10, wherein the compensation capacitance elements 36 to 38 each include a lower electrode 36, a capacitance insulating film 37, and an upper electrode 38, the lower electrode 36, capacitance insulating film 37, and upper electrode 38 being the same as those of the cell capacitors, and wherein the compensation capacitance elements are formed over an upper layer of the second region 10 excluding upper layer portions of drain diffusion layers 44, 46 or gate electrodes 32 of transistors in the functional circuit.
Public/Granted literature
- US20100059806A1 Semiconductor device Public/Granted day:2010-03-11
Information query
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