Invention Grant
- Patent Title: Electronic component with layered frame
- Patent Title (中): 电子元件分层框架
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Application No.: US11635874Application Date: 2006-12-08
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Publication No.: US08125060B2Publication Date: 2012-02-28
- Inventor: Wu Hu Li , Heng Wan Hong
- Applicant: Wu Hu Li , Heng Wan Hong
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
An electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.
Public/Granted literature
- US20080135995A1 Electronic component Public/Granted day:2008-06-12
Information query
IPC分类:
