In the specification and drawing a package structure is described and shown with a first die including a high side driver and at least a first bonding pad, a second die including a low side driver, a high withstand voltage device, a controller coupled with the low side driver and the high withstand voltage device and at least a second bonding pad, and at least one conducting wire, in which the high side driver is coupled through the first bonding pad, the conducting wire, the second bonding pad and the high withstand voltage device to the controller.