Invention Grant
US08125074B2 Laminated substrate for an integrated circuit BGA package and printed circuit boards
有权
用于集成电路BGA封装和印刷电路板的层压基板
- Patent Title: Laminated substrate for an integrated circuit BGA package and printed circuit boards
- Patent Title (中): 用于集成电路BGA封装和印刷电路板的层压基板
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Application No.: US12558417Application Date: 2009-09-11
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Publication No.: US08125074B2Publication Date: 2012-02-28
- Inventor: Nedyalko Slavov , Heinz-Peter Wirtz , Kwei-Kuan Kuo
- Applicant: Nedyalko Slavov , Heinz-Peter Wirtz , Kwei-Kuan Kuo
- Applicant Address: CH Geneva
- Assignee: ST-Ericsson SA
- Current Assignee: ST-Ericsson SA
- Current Assignee Address: CH Geneva
- Agency: Potomac Patent Group PLLC
- Main IPC: H01L23/053
- IPC: H01L23/053 ; H01L23/12
Abstract:
A laminated substrate for an integrated circuit package, including a core layer and at least one build-up layer located above only one side of said core layer. An integrated circuit package, including a laminated substrate and including an integrated circuit die placed above the side build-up layer.
Public/Granted literature
- US20110061917A1 LAMINATED SUBSTRATE FOR AN INTEGRATED CIRCUIT BGA PACKAGE AND PRINTED CIRCUIT BOARDS Public/Granted day:2011-03-17
Information query
IPC分类:
