Invention Grant
US08125076B2 Semiconductor package system with substrate heat sink 有权
半导体封装系统带衬底散热片

Semiconductor package system with substrate heat sink
Abstract:
A semiconductor package system is provided including: providing a substrate having substrate wiring and a cavity provided therein with a heat sink foil closing off the cavity; attaching a semiconductor die in the cavity to the heat sink foil; and bonding the semiconductor die to the substrate wiring.
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