Invention Grant
- Patent Title: Semiconductor package system with substrate heat sink
- Patent Title (中): 半导体封装系统带衬底散热片
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Application No.: US11164132Application Date: 2005-11-10
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Publication No.: US08125076B2Publication Date: 2012-02-28
- Inventor: Gwang Kim , Koo Hong Lee
- Applicant: Gwang Kim , Koo Hong Lee
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/10

Abstract:
A semiconductor package system is provided including: providing a substrate having substrate wiring and a cavity provided therein with a heat sink foil closing off the cavity; attaching a semiconductor die in the cavity to the heat sink foil; and bonding the semiconductor die to the substrate wiring.
Public/Granted literature
- US20060103010A1 SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HEAT SINK Public/Granted day:2006-05-18
Information query
IPC分类: