Invention Grant
- Patent Title: Light emitting diode module with improved heat-dissipation efficiency
- Patent Title (中): 发光二极管模块具有改善的散热效率
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Application No.: US13118564Application Date: 2011-05-30
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Publication No.: US08125588B2Publication Date: 2012-02-28
- Inventor: Chien-Chang Pei
- Applicant: Chien-Chang Pei
- Applicant Address: CN Shanghai TW New Taipei
- Assignee: Everlight Yi-Guang Technology (Shanghai) Ltd.,Everlight Electronics Co., Ltd.
- Current Assignee: Everlight Yi-Guang Technology (Shanghai) Ltd.,Everlight Electronics Co., Ltd.
- Current Assignee Address: CN Shanghai TW New Taipei
- Agency: Han IP Law PLLC
- Agent Andy M. Han
- Priority: TW96208407U 20070523
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; G02F1/1335 ; F21V7/04

Abstract:
Various embodiments of a lighting module are described. In one aspect, a lighting module comprises a metal support, a circuit board, and a plurality of light emitting diodes. The metal support has a recess, sidewalls, and a plurality of holes on the sidewalls. The circuit board is fastened on a bottom portion of the recess of the metal support and has two long sides, two short sides, and a respective plurality of flanges on each of the two long sides. The flanges are inserted into the holes of the metal support to compact the circuit board and the metal support. The light emitting diodes are disposed on the circuit board.
Public/Granted literature
- US20110255030A1 Light Emitting Diode Module Public/Granted day:2011-10-20
Information query
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