Invention Grant
- Patent Title: Wiring substrate and electronic device
- Patent Title (中): 接线基板和电子设备
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Application No.: US12046893Application Date: 2008-03-12
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Publication No.: US08125789B2Publication Date: 2012-02-28
- Inventor: Takao Nishimura
- Applicant: Takao Nishimura
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2007-061531 20070312
- Main IPC: H05K7/10
- IPC: H05K7/10
Abstract:
A wiring substrate includes a plurality of electrode terminals, to which external connection terminals of an electronic component are coupled, arranged in a row on one principal surface thereof, wherein the electrode terminals each include: a first linear portion; a second linear portion extending from an end of the first linear portion in a direction different from a direction of the first linear portion; and a bent portion that is a part where the first linear portion and the second linear portion are connected.
Public/Granted literature
- US20080223608A1 WIRING SUBSTRATE AND ELECTRONIC DEVICE Public/Granted day:2008-09-18
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