Invention Grant
US08125792B2 Substrate for wiring, semiconductor device for stacking using the same, and stacked semiconductor module
有权
布线用基板，使用该基板的层叠用半导体装置以及叠层型半导体模块
- Patent Title: Substrate for wiring, semiconductor device for stacking using the same, and stacked semiconductor module
- Patent Title (中): 布线用基板，使用该基板的层叠用半导体装置以及叠层型半导体模块
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Application No.: US12330686Application Date: 2008-12-09
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Publication No.: US08125792B2Publication Date: 2012-02-28
- Inventor: Takeshi Kawabata
- Applicant: Takeshi Kawabata
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Panasonic Patent Center
- Agent Dhiren Odedra; Kerry Culpepper
- Priority: JP2007-317797 20071210
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
In a stacked semiconductor module, a test covering connecting terminals is easily conducted and high reliability is achieved.
Public/Granted literature
- US20090147490A1 SUBSTRATE FOR WIRING, SEMICONDUCTOR DEVICE FOR STACKING USING THE SAME, AND STACKED SEMICONDUCTOR MODULE Public/Granted day:2009-06-11
Information query
