An inventive substrate treatment apparatus includes a substrate rotation unit which rotates a substrate, a brush to be brought into contact with at least a peripheral edge portion of a front surface of the substrate rotated by the substrate rotation unit, and a peripheral rinse liquid ejection unit which ejects a rinse liquid toward a predetermined rinse liquid applying position on the peripheral edge portion of the front surface of the substrate from a position located radially inward of the predetermined rinse liquid applying position with respect to a rotation radius of the substrate, the predetermined rinse liquid applying position being spaced downstream in a substrate rotation direction from a brush contact area of the peripheral edge portion kept in contact with the brush.