Invention Grant
- Patent Title: Method for assembling components of a microstimulator
- Patent Title (中): 微型激励器组件组装方法
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Application No.: US12848610Application Date: 2010-08-02
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Publication No.: US08127424B2Publication Date: 2012-03-06
- Inventor: Matthew I. Haller , Tom Xiaohai He , Jay Daulton
- Applicant: Matthew I. Haller , Tom Xiaohai He , Jay Daulton
- Applicant Address: US CA Valencia
- Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee Address: US CA Valencia
- Agency: Wong Cabello Lutsch, Rutherford & Brucculeri, LLP
- Main IPC: B14B17/00
- IPC: B14B17/00

Abstract:
An electrode assembly includes an electrode electrically connected to a capacitor with a wire. An assembly carrier may be used to hold and secure at least the wire and capacitor during assembly. A method of assembly for attaching a wire to a capacitor and an electrode may include an assembly carrier for housing and securing the wire, capacitor, and electrode during assembly.
Public/Granted literature
- US20100293774A1 Assembly for a Microstimulator Public/Granted day:2010-11-25
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