Invention Grant
- Patent Title: Apparatus assembly and disassembly of a tire curing mold
- Patent Title (中): 轮胎固化模具的装置组装和拆卸
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Application No.: US11962166Application Date: 2007-12-21
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Publication No.: US08127434B2Publication Date: 2012-03-06
- Inventor: William Dudley Currie , Dennis Alan Lundell , David Alan Henthorne
- Applicant: William Dudley Currie , Dennis Alan Lundell , David Alan Henthorne
- Applicant Address: US OH Akron
- Assignee: The Goodyear Tire & Rubber Company
- Current Assignee: The Goodyear Tire & Rubber Company
- Current Assignee Address: US OH Akron
- Agent Richard B. O'Planick
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
Apparatus and method for assembly and disassembly in axial and radial directions mold segments forming a toroidally shaped mold. The apparatus includes mold gripping apparatus operatively engaging and disengaging the mold; and mold transport apparatus for operatively moving the mold gripping apparatus and engaged mold between a mold assembly and disassembly station and a tire curing station. The mold gripping apparatus engages and unlocks an upper mold sidewall segment and mold loading apparatus engages and unlocks a lower mold sidewall segment. Tread segment closing apparatus is provided for operatively opening and closing the tread segments of the mold in a radial direction.
Public/Granted literature
- US20090158573A1 APPARATUS AND METHOD FOR ASSEMBLY AND DISASSEMBLY OF A TIRE CURING MOLD Public/Granted day:2009-06-25
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