Invention Grant
- Patent Title: Method for integrating heat transfer members, and an LED device
- Patent Title (中): 用于集成传热构件的方法和LED装置
-
Application No.: US12414770Application Date: 2009-03-31
-
Publication No.: US08127445B2Publication Date: 2012-03-06
- Inventor: Yuji Saga , Narumi Une , Yoshinobu Uchida
- Applicant: Yuji Saga , Narumi Une , Yoshinobu Uchida
- Applicant Address: US DE Wilmington
- Assignee: E. I. Du Pont de Nemours and Company
- Current Assignee: E. I. Du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: B21D53/02
- IPC: B21D53/02 ; H05K7/20

Abstract:
Disclosed is a method for integrating at least two heat transfer members to provide an integrated composite member, the method comprising: a) disposing the at least two heat transfer members in a mold cavity, such that said heat transfer members each have at least one exposed surface forming a surface of a resin injection cavity; and b) injecting a thermally conductive resin into the resin injection cavity to contact the exposed surfaces of the at least two heat transfer members, to form the integrated composite member; wherein the thermally conductive resin has a thermal conductivity of at least 0.7 W/mK or higher.
Public/Granted literature
- US20090251864A1 METHOD FOR INTEGRATING HEAT TRANSFER MEMBERS,AND AN LED DEVICE Public/Granted day:2009-10-08
Information query