Invention Grant
- Patent Title: Multi-pattern material punch
- Patent Title (中): 多图案材料冲孔
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Application No.: US12445117Application Date: 2007-10-12
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Publication No.: US08127651B2Publication Date: 2012-03-06
- Inventor: Sherri L. Henkemeyer , Carmen Lira-Nunez
- Applicant: Sherri L. Henkemeyer , Carmen Lira-Nunez
- Applicant Address: US MN St. Cloud
- Assignee: The Antioch Company LLC
- Current Assignee: The Antioch Company LLC
- Current Assignee Address: US MN St. Cloud
- Agency: Dicke, Billig & Czaja PLLC
- International Application: PCT/US2007/081309 WO 20071012
- International Announcement: WO2008/046076 WO 20080417
- Main IPC: B26F1/04
- IPC: B26F1/04
Abstract:
A system for punching one or more patterns selected from a plurality of related patterns into a workpiece (typically paper or similar materials). The system comprises a punch element having a plurality of cutting surfaces arranged at discrete heights relative to each other, and a means for selecting a discrete distance that the punch element travels through the workpiece.
Public/Granted literature
- US20100294102A1 MULTI-PATTERN MATERIAL PUNCH Public/Granted day:2010-11-25
Information query
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