Invention Grant
- Patent Title: Pile transfer device and method
- Patent Title (中): 桩移装置及方法
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Application No.: US11886614Application Date: 2006-03-21
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Publication No.: US08127917B2Publication Date: 2012-03-06
- Inventor: Peter Enenkel
- Applicant: Peter Enenkel
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- International Application: PCT/IB2006/000960 WO 20060321
- International Announcement: WO2006/100604 WO 20060928
- Main IPC: B65G37/00
- IPC: B65G37/00

Abstract:
In a mail processing system, a support element has a flat floor with elements spaced from each other so that a comb-type or fork-type structure is produced, wherein the elements have front section extending upwards. A first transport device has a number of bands equipped with sectional separators, which are spaced from one another. To transfer piled postal items from the support element to the first transport device the floor is aligned with the transport device, and the floor and the transport device are interlocked, so that at least a part of one of the bands extends between the elements.
Public/Granted literature
- US20090060698A1 Pile Transfer Device and Method Public/Granted day:2009-03-05
Information query
IPC分类: