The present invention provides a process for manufacturing an ink-jet printhead comprising the steps of providing a print head wafer comprising a plurality of print head dice, each print head die comprising a nozzle plate bonded to a barrier layer formed on a substrate, wherein said plurality of print head dice are arranged on the substrate so as to define at least one first dividing channel comprising at least one first channel portion, said at least one first channel portion having a bottom portion comprised between the lateral sides of said barrier layer of at least two adjacent print head dice and an upper portion comprised between the lateral sides of said nozzle plate of said at least two adjacent print head dice, and applying an adhesive composition in an amount able to substantially fill the whole length of said at least one first channel portion.