Invention Grant
US08128210B2 Fluid ejecting apparatus and fluid filling method of fluid ejecting apparatus
有权
流体喷射装置和流体喷射装置的流体填充方法
- Patent Title: Fluid ejecting apparatus and fluid filling method of fluid ejecting apparatus
- Patent Title (中): 流体喷射装置和流体喷射装置的流体填充方法
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Application No.: US12176771Application Date: 2008-07-21
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Publication No.: US08128210B2Publication Date: 2012-03-06
- Inventor: Takeo Seino , Taro Takekoshi , Norihisa Kobayashi , Noritsuna Rokuhara
- Applicant: Takeo Seino , Taro Takekoshi , Norihisa Kobayashi , Noritsuna Rokuhara
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2007-189068 20070720; JP2007-189075 20070720; JP2007-318034 20071210
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
A fluid ejecting apparatus includes a fluid containing portion, a fluid discharging portion, a flow passage forming portion and a valve mechanism. The fluid containing portion contains fluid. The fluid discharging portion discharges the fluid. The flow passage forming portion forms a fluid flow passage that extends from the fluid containing portion to the fluid discharging portion. The valve mechanism is able to open or close the fluid flow passage. The fluid ejecting apparatus is placed in an initial state before an initial use of the fluid ejecting apparatus, wherein fluid is contained in the fluid containing portion and at least portion of the fluid flow passage from a position of the fluid containing portion to a position of the valve mechanism is filled with the fluid and the fluid flow passage is closed by the valve mechanism.
Public/Granted literature
- US20090021564A1 FLUID EJECTING APPARATUS AND FLUID FILLING METHOD OF FLUID EJECTING APPARATUS Public/Granted day:2009-01-22
Information query
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