Invention Grant
- Patent Title: Material cutter with a selectable cutting profile
- Patent Title (中): 材料切割机具有可选择的切割轮廓
-
Application No.: US12578074Application Date: 2009-10-13
-
Publication No.: US08128217B2Publication Date: 2012-03-06
- Inventor: Michael Scott Adams , Marc R. Obenshain
- Applicant: Michael Scott Adams , Marc R. Obenshain
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Robert A. McCann; Christopher S. Clancy
- Main IPC: B41J2/01
- IPC: B41J2/01 ; B41J15/18

Abstract:
A material cutter for producing a selected cutting profile. The material cutter includes a cutter frame and a cutter button. The cutter frame has a stationary blade. The cutter button, which is slidably mounted in the cutter frame, has a moving blade with a cutting edge. The cutter button preferably includes a profile selector, so that when a driving force is applied to the cutter button, the moving blade slides past the stationary blade to the extent allowed by the profile selector. The profile selector may be a knob and the cutting profile may be set manually or automatically. It is preferred that at least one of the selectable cutting profiles is a partial cut.
Public/Granted literature
- US20100018376A1 Material Cutter with a Selectable Cutting Profile Public/Granted day:2010-01-28
Information query
IPC分类: