Invention Grant
- Patent Title: Methods and apparatus for thin metal film thickness measurement
- Patent Title (中): 薄金属薄膜厚度测量方法和设备
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Application No.: US12508838Application Date: 2009-07-24
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Publication No.: US08128278B2Publication Date: 2012-03-06
- Inventor: Yehiel Gotkis , Mikhail Korolik
- Applicant: Yehiel Gotkis , Mikhail Korolik
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla Group, Inc.
- Main IPC: G01N25/00
- IPC: G01N25/00 ; G01N17/00 ; G01K3/00

Abstract:
A method for measuring a metal film thickness is provided. The method initiates with heating a region of interest of a metal film with a defined amount of heat energy. Then, a temperature of the metal film is measured. Next, a thickness of the metal film is calculated based upon the temperature and the defined amount of heat energy. A chemical mechanical planarization system capable of detecting a thin metal film through the detection of heat transfer dynamics is also provided.
Public/Granted literature
- US20090310643A1 Methods and Apparatus for Thin Metal Film Thickness Measurement Public/Granted day:2009-12-17
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