Invention Grant
- Patent Title: Methods and apparatus for connecting printed circuit boards using zero-insertion wiping force connectors
- Patent Title (中): 使用零插拔擦连接器连接印刷电路板的方法和装置
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Application No.: US12563319Application Date: 2009-09-21
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Publication No.: US08128417B2Publication Date: 2012-03-06
- Inventor: Frank Schonig
- Applicant: Frank Schonig
- Applicant Address: US MA North Reading
- Assignee: Teradyne, Inc.
- Current Assignee: Teradyne, Inc.
- Current Assignee Address: US MA North Reading
- Agency: BainwoodHuang
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R13/15

Abstract:
A circuit board assembly includes a primary board, and a connector mounted to a mounting location of the primary board. The connector includes compliant conductors, each compliant conductor having a first end and a second end. The connector further includes a connector body supported by the primary board. The connector body constrains the first end of each compliant conductor at the mounting location and the second end of each compliant conductor at an interface location. The connector further includes a movable member which is capable of moving relative to the connector body along an axis extending between the mounting location and the interface location. The movable member is constructed and arranged to control tension of the compliant conductors while the connector body constrains the first end of each compliant conductor at the mounting location and the second end of each compliant conductor at the interface location.
Public/Granted literature
- US20110070748A1 METHODS AND APPARATUS FOR CONNECTING PRINTED CIRCUIT BOARDS USING ZERO-INSERTION WIPING FORCE CONNECTORS Public/Granted day:2011-03-24
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