The present invention is direct to a modular jack (10) having improved cross talk compensation performances. A printed circuit board (30) is inserted into the housing (20) of the modular jack (10). Robust receptacle terminals (11 to 18) and a multi-stage time delay and cross talk compensation circuitry are disposed on the circuit board (30) to reduce cross talk induced between receptacle terminals. Each robust receptacle terminal (11-18) comprises first and second legs (11a, lib; lid) located over one another with one end of each leg joined to the other leg by a bent portion (lie). The first leg (11a, lib) ends in a free end and the second leg (lid) extends from the base end (11f) to the bent portion (lie) to form an acute angle with the circuit board (30). The bent portion (lie) of each receptacle terminal is cantilevered to engage the circuit board at least when one or more of the receptacle terminals (11-18) is contacted by the terminal of a modular plug.