Invention Grant
- Patent Title: Assembly for use in implantation of a joint component
- Patent Title (中): 用于植入关节成分的组装
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Application No.: US12593348Application Date: 2008-03-27
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Publication No.: US08128705B2Publication Date: 2012-03-06
- Inventor: Alec Birkbeck , Dean Cowan
- Applicant: Alec Birkbeck , Dean Cowan
- Applicant Address: GB
- Assignee: DePuy International Limited
- Current Assignee: DePuy International Limited
- Current Assignee Address: GB
- Priority: GB0705942.1 20070328
- International Application: PCT/GB2008/001060 WO 20080327
- International Announcement: WO2008/117058 WO 20081002
- Main IPC: A61F2/36
- IPC: A61F2/36

Abstract:
An assembly for use in a procedure for implantation of an orthopedic joint component, comprises a head part of the joint component which has a tapered bore within it, and a connector part which is tapered inwardly along its length so that it can be received snugly in the tapered bore in the head part, the connector part having a bore within it. A tool includes a spigot which fits snugly into the bore in the connector part. Each of the tool and the connector part has a face which contact one another when the spigot on the tool is fully received in the bore in the connector part, and in which each of the said faces extends generally transverse relative to the aligned axes of the spigot and the bore.
Public/Granted literature
- US20100168865A1 ASSEMBLY FOR USE IN IMPLANTATION OF A JOINT COMPONENT Public/Granted day:2010-07-01
Information query
IPC分类: