Invention Grant
US08128752B2 Roll-to-roll substrate transfer apparatus, wet etching apparatus comprising the same and apparatus for manufacturing printed circuit board 有权
卷对卷基板输送装置,包含该蚀刻装置的湿式蚀刻装置以及印刷电路板的制造装置

  • Patent Title: Roll-to-roll substrate transfer apparatus, wet etching apparatus comprising the same and apparatus for manufacturing printed circuit board
  • Patent Title (中): 卷对卷基板输送装置,包含该蚀刻装置的湿式蚀刻装置以及印刷电路板的制造装置
  • Application No.: US12317562
    Application Date: 2008-12-23
  • Publication No.: US08128752B2
    Publication Date: 2012-03-06
  • Inventor: Deok-heung Kim
  • Applicant: Deok-heung Kim
  • Applicant Address: KR Changwon
  • Assignee: Samsung Techwin Co., Ltd.
  • Current Assignee: Samsung Techwin Co., Ltd.
  • Current Assignee Address: KR Changwon
  • Agency: Drinker Biddle & Reath LLP
  • Priority: KR10-2007-0136376 20071224
  • Main IPC: C23F1/00
  • IPC: C23F1/00 B65G13/02
Roll-to-roll substrate transfer apparatus, wet etching apparatus comprising the same and apparatus for manufacturing printed circuit board
Abstract:
In one aspect, a roll-to-roll substrate transfer apparatus is provided that includes: a feed roll and a take-up roll between which a printed circuit board substrate extends; and a plurality of drive roller rows transmitting motive power to the substrate for moving the substrate in a transferring direction, each drive roller row of the plurality includes a roller axis arranged in a direction perpendicular to the transferring direction of the substrate, and a plurality of spaced-apart drive rollers on the roller axis, wherein drive rollers of one drive roller row are arranged in spaces between drive rollers of adjacent drive roller rows. In other aspects, a wet etching apparatus and an apparatus for manufacturing a printed circuit board that include the roll-to-roll substrate transfer apparatus are provided.
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