Invention Grant
- Patent Title: Thermal transfer methods and structures for microfluidic systems
- Patent Title (中): 微流体系统的热转移方法和结构
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Application No.: US11962703Application Date: 2007-12-21
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Publication No.: US08128893B2Publication Date: 2012-03-06
- Inventor: William Bedingham , Christopher R. Kokaisel , Jeffrey C. Pederson
- Applicant: William Bedingham , Christopher R. Kokaisel , Jeffrey C. Pederson
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Nicole J. Einerson
- Main IPC: B01L7/00
- IPC: B01L7/00

Abstract:
Processing devices that include one or more process arrays with thermal transfer structures that can be used alone or in conjunction with gravity/rotation to transport fluids within a microfluidic system. The thermal transport function can be accomplished by changing the temperature of one or more chambers to create a vacuum to draw fluids in selected directions within the process array. The methods and apparatus of the present invention may provide the ability to move fluids in a direction that is against the direction of gravity or any centrifugal forces generated by rotating a processing device using the thermal transfer structures. In other words, fluids may be moved against the direction of gravity or towards the axis of rotation using the thermally-activated vacuum.
Public/Granted literature
- US20080149190A1 THERMAL TRANSFER METHODS AND STRUCURES FOR MICROFLUIDIC SYSTEMS Public/Granted day:2008-06-26
Information query
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