Invention Grant
US08129004B2 Donor substrate and transfer method using same, method of manufacturing display device, and system of manufacturing display device 失效
供体基板和使用其的转印方法,显示装置的制造方法以及制造显示装置的系统

  • Patent Title: Donor substrate and transfer method using same, method of manufacturing display device, and system of manufacturing display device
  • Patent Title (中): 供体基板和使用其的转印方法,显示装置的制造方法以及制造显示装置的系统
  • Application No.: US12295431
    Application Date: 2007-04-05
  • Publication No.: US08129004B2
    Publication Date: 2012-03-06
  • Inventor: Keisuke Matsuo
  • Applicant: Keisuke Matsuo
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: SNR Denton US LLP
  • Priority: JP2006-104991 20060406
  • International Application: PCT/JP2007/057652 WO 20070405
  • International Announcement: WO2007/116934 WO 20071018
  • Main IPC: B41M5/00
  • IPC: B41M5/00 B29C65/00 B32B37/00 B32B38/04 G03C8/00
Donor substrate and transfer method using same, method of manufacturing display device, and system of manufacturing display device
Abstract:
A red organic light emitting element formed by a simple process of a thermal transfer method and a display device including the same are provided. A donor substrate 100 has a reflecting layer 120 in a planned formation region 100R1 of a red transfer layer viewed from a front face side of a base 110, and has the reflecting layer 120 in a non-transfer region 100NP viewed from the rear face side of the base 110. A red transfer layer 200R is formed on the whole area on the front face side of the base 110, laser light LB1 is irradiated from the front face side of the base 110 to form the red transfer layer 200R only in the red transfer layer planned formation region 100R1, and then a green transfer layer 200G is formed on the whole area on the front face side of the base 110. The donor substrate 100 and the substrate 11 are oppositely arranged, laser light LB2 is irradiated from the rear face side of the base 110, and thereby the red transfer layer 200R and other portions the non-transfer region 100NP of the green transfer layer 200G are transferred at a time to the substrate 11.
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