Disclosed are lamination processes using an ethylene copolymer to provide improved adhesion of foil to thermoplastic compositions (for example, polyester or polyolefins such as polyethylene and polypropylene). Also disclosed are multilayer structures comprising foil laminated to thermoplastic compositions using ethylene copolymer composition as a tie layer. These multilayer structures are useful as packaging films and industrial films. Also disclosed are packages that comprise these multilayer structures.