Invention Grant
- Patent Title: High strength and high thermal conductivity heat transfer apparatus
- Patent Title (中): 高强度高导热传热装置
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Application No.: US12119543Application Date: 2008-05-13
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Publication No.: US08129036B2Publication Date: 2012-03-06
- Inventor: Durwood M. Beringer , Kenneth J. Zacharias , Jesse J. Stieber , Edmund P. Taddey , Stephen A. Yaworski , Gregory K. Schwalm
- Applicant: Durwood M. Beringer , Kenneth J. Zacharias , Jesse J. Stieber , Edmund P. Taddey , Stephen A. Yaworski , Gregory K. Schwalm
- Applicant Address: US CT Windsor Locks
- Assignee: Hamilton Sundstrand Space Systems International, Inc.
- Current Assignee: Hamilton Sundstrand Space Systems International, Inc.
- Current Assignee Address: US CT Windsor Locks
- Agency: Carlson Gaskey & Olds, P.C.
- Main IPC: B32B15/20
- IPC: B32B15/20 ; B32B15/18 ; F28F21/08
Abstract:
A heat transfer apparatus includes a first protective layer of a first metallic material, a second protective layer of a second metallic material, and a heat transfer layer bonded between the first protective layer and the second protective layer. The heat transfer layer is made of a metal matrix composite, such as aluminum oxide reinforcement dispersed within a copper matrix.
Public/Granted literature
- US20090283250A1 HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY HEAT TRANSFER APPARATUS Public/Granted day:2009-11-19
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